FSBF10CH60B【PDF 5/15 页】MODULE SPM 600V 10A 3PH SPM27-JA

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Absolute Maximum Ratings (T J = 25°C,

Inverter Part

unless otherwise specified.)

Symbol

V PN

V PN(Surge)

V CES

± I C

± I CP

Parameter

Supply Voltage

Supply Voltage (Surge)

Collector - Emitter Voltage

Each IGBT Collector Current

Each IGBT Collector Current (Peak)

Conditions

Applied between P - N U , N V , N W

Applied between P - N U , N V , N W

T C = 25°C, T J ?? 150°C

T C = 25°C, T J ?? 150°C, Under 1 ms Pulse

Rating

450

500

600

10

20

Unit

V

V

V

A

A

Width

P C

T J

Collector Dissipation

Operating Junction Temperature

T C = 25°C per Chip

(2nd Note 1)

22

- 40 ~ 150

W

°C

2nd Notes:

1. The maximum junction temperature rating of the power chips integrated within the Motion SPM ? 3 product is 150 ? C (at T C ? 125 ? C).

Control Part

Symbol

V CC

V BS

Parameter

Control Supply Voltage

High-Side Control Bias Voltage

Conditions

Applied between V CC(H) , V CC(L) - COM

Applied between V B(U) - V S(U) , V B(V) - V S(V) ,

Rating

20

20

Unit

V

V

V B(W) - V S(W)

V IN

Input Signal Voltage

Applied between IN (UH) , IN (VH) , IN (WH) ,

-0.3 ~ V CC + 0.3

V

IN (UL) , IN (VL) , IN (WL) - COM

V FO

I FO

V SC

Fault Output Supply Voltage

Fault Output Current

Current-Sensing Input Voltage

Applied between V FO - COM

Sink Current at V FO pin

Applied between C SC - COM

-0.3 ~ V CC + 0.3

5

-0.3 ~ V CC + 0.3

V

mA

V

Bootstrap Diode Part

Symbol

V RRM

I F

Parameter

Maximum Repetitive Reverse Voltage

Forward Current

Conditions

T C = 25°C, T J ?? 150°C

Rating

600

0.5

Unit

V

A

I FP

Forward Current (Peak)

T C = 25°C, T J ?? 150°C

Under 1 ms Pulse

2.0

A

Width

T J

Operating Junction Temperature

-40 ~ 150

°C

Total System

Symbol

V PN(PROT)

T C

T STG

V ISO

Parameter

Self-Protection Supply Voltage Limit

(Short-Circuit Protection Capability)

Module Case Operation Temperature

Storage Temperature

Isolation Voltage

Conditions

V CC = V BS = 13.5 ~ 16.5 V

T J = 150°C, Non-Repetitive, < 2 ? s

-40 ? C ??? T J ? 150 ? C, See Figure 2

60 Hz, Sinusoidal, AC 1 Minute, Connect

Rating

400

-40 ~ 125

-40 ~ 125

2500

Unit

V

°C

°C

V rms

Pins to Heat Sink Plate

Thermal Resistance

Symbol

Parameter

Conditions

Min.

Typ. Max.

Unit

R th(j-c)Q

R th(j-c)F

Junction to Case Thermal Resistance

Inverter IGBT Part (per 1 / 6 module)

Inverter FWDi Part (per 1 / 6 module)

-

-

-

-

5.5

6.3

°C / W

°C / W

2nd Notes:

2. For the measurement point of case temperature (T C ), please refer to Figure 2.

?2007 Fairchild Semiconductor Corporation

FSBF10CH60B Rev. C3

5

www.fairchildsemi.com

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